The underlying technologies are mostly in place, but the industry will need the right processes and tools before chiplets can deliver on their promise.
Intel Ponte Vecchio GPU to Feature 63 Chiplets, Foveros 3D Stacking. (Image: Intel)
By Ron Wilson
What’s at stake:
Chiplets could break through the barriers obstructing Moore’s Law and disrupt the semiconductor supply chain. But they depend on sometimes-complex packaging solutions that are far from established technologies.
With their claimed ability to deconstruct one massive, leading-edge SoC into an assembly of smaller dies built in less-aggressive processes, chiplets hint at a way forward that bypasses the dotage of Moore’s Law. By offering an alternative, they also promise a diversion around the two-party monopoly on chip fabrication beyond 10nm, suggesting more diverse, robust supply chains.