• Audition
Startup Eliyan claims its technology addresses the need for commercially viable die-to-die interconnects in standard organic packaging, targeting high-performance computing requirements.
Eliyan founders (from left): Syrus Ziai, Ramin Farjadrad, Patrick Soheili (image: Eliyan)
By Junko Yoshida.
What’s at stake?
Chiplets are emerging as the go-to technology for advanced SoCs designed for AI accelerator, data center and cloud computing applications. Despite years of implementation, these chiplets still face many challenges, including interconnect interfaces and protocols, packaging and quality control. Startup Eliyan is confident it has a technology that helps chipmakers overcome those hurdles.