Skip to content
News & Analysis

Intel Prepares to Break Ground on Ohio Fab

The ground-breaking ceremony near Columbus includes an impressive guest list.
Intel mega-fab in Ohio
Source: Intel Corp.

Share This Post:

By George Leopold

Construction of Taiwan Semiconductor Manufacturing Co.’s Arizona fab and Samsung’s facility in Texas is well underway. Since passage of U.S. chip subsidies last month, the semiconductor industry has been waiting for the next shoe to drop: When will Intel Corp. break ground on its much-ballyhooed “mega-fab” in Ohio?

The answer, the company revealed this week, is Friday, Sept. 9. The guest list includes the President of the United States.

Along with President Joe Biden, Intel CEO Pat Gelsinger and Randhir Thakur, president of Intel Foundry Services, will be joined by Ohio Gov. Mike DeWine and local officials. Biden is expected to use the event in Licking County to promote provisions of the CHIPS and Science Act and earlier U.S. infrastructure legislation.

Proposed Intel fabs in Ohio
A rendering shows plans for two new Intel fabs in Licking County, Oho. (Source: Intel Corp.)

The $20 billion fab investment is critical to Intel’s foundry services initiative. The company expects the Ohio fab to generate an estimated 7,000 construction jobs. If and when production begins, Intel said it will hire 3,000 fab engineers and technicians. The long-term goal is creating a semiconductor manufacturing ecosystem that links suppliers and partners as well as researchers at nearby Ohio State University.


Recommended: Following the Money: How CHIPS Act Subsidies Will Be Spent


Meanwhile, details on eligibility for $52.7 billion in CHIPS Act funding are trickling out. The Commerce Department launched its CHIPS.gov website in late August to jump start the competition for federal funding. Among the implementation priorities listed are meeting economic and national security needs along with reestablishing U.S. leadership in semiconductor design and manufacturing.

Legislation caps individual CHIPS Act investments at $3 billion. Larger awards would require presidential approval. Given Intel’s extensive White House contacts, one question is whether the U.S. chipmaker would gain U.S. chip subsidies beyond the current $3 billion limit.

Addressing disbursement of CHIPS Act funding, Commerce Secretary Gina Riamondo stressed during an event this week at Arizona State University: “It’ll be competitive. It’ll be transparent and I hope every state competes.”


George Leopold is executive editor of the Ojo-Yoshida Report. He can be reached at g.leopold@ojoyoshidareport.com.

Share This Post: