Multi-die chip design, Source: Synopsys
By Ron Wilson
What’s at stake:
Integrated circuits operating at high speed generate a lot of heat, enough to destroy themselves and their surroundings. With the advent of dense advanced-packaging modules for AI, the old solutions are no longer sufficient, and the race is on to find alternatives. The demands are intense, however, and all players, including EDA vendors and physical analysis solutions vendors will have to team up with design engineers to develop a common thermal model with packaging companies.
Recently discussions have flared up about thermal issues in advanced packaging. But since the beginning of the semiconductor industry heat has lurked just below the surface, threatening to bubble up and make a mess of project schedules and system performance.
Today, as the inexhaustible demands of AI drive a convergence of Angstrom-era dies, advanced 3D packaging, and liquid cooling, the pot is boiling over.