(Source: DreamBig Semiconductor)
What’s at stake?
With chiplets poised to disaggregate SoCs into tiny dies, companies have begun to generate new ideas, tools and “chiplet platforms” designed to put back together these small dies (chiplets) – horizontally or vertically – in an advanced form of system-in-package. It is almost ironic that the chiplet originally conceived to disaggregate SoCs in Lego-like blocks appears to be getting back into an integration race again.
DreamBig Semiconductor, based in San Jose, Calif., is one of the startups at the gate. It came to CES last week and unveiled an “Open Chiplet Platform” called MARS.
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