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Chiplets Are a Second Path to Higher Integration

An emerging infrastructure supporting multiple dies in a package could reorder the global semiconductor industry.
Intel chiplet system of chips

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By Ron Wilson

What’s at stake:
As the industry moves down the Moore’s Law path toward 2nm, increasing design and process costs and spiraling complexity threaten to limit the game to only two or three fabrication companies and only a few of their customers. But a reconsideration of an old idea—building a system out of multiple dies in a single package—could break through these strictures, reopening the industry to smaller customers and giving many organizations and many countries opportunities to participate.

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