The EU is betting big on the technology’s ability to meld low-power or RF circuitry with advanced digital chips.
Source: GSA
By Ron Wilson
What’s at stake?
Fully depleted silicon-on-insulator solves the problem of leakage for chip makers, but the technology lags behind more-traditional FinFET processes. Now, the EU is banking on a new spin of FD-SOI as its ticket to sophisticated, next-generation ICs.