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Chiplet Mission: Navigate Interconnect Complexity

Blue Cheetah pushes die-to-die interconnect technology that, it claims, is both ‘standards-based’ and ‘customizable.’
Chiplet Mission: Navigate Interconnect Complexity
(Image: Blue Cheetah)

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By Junko Yoshida

What’s at stake
Chiplets present a set of multi-layered, multi-faceted, multi-dimensional technology and business problems with no one-size-fits-all answer. Numerous startups are proposing various solutions to tackle the complexity of die-to-die interconnects.

For every player in the semiconductor supply chain – from chip designers and EDA tool vendors to semiconductor foundries, OSAT companies and the Babel of technology startups – the toughest challenge, arguably, boils down to how to connect chiplets.

Fortunately, startups such as Eliyan, Blue Cheetah and YorChip are poised to tackle the issues, each in its own way.

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